Factory Lead Time  

24 Weeks

Mount  

Surface Mount

Mounting Type  

Surface Mount

Package / Case  

2-XDFN

Number of Pins  

2

Diode Element Material  

SILICON

Operating Temperature (Max)  

150°C

Operating Temperature (Min)  

-55°C

Number of Elements  

1

Packaging  

Tape & Reel (TR)

Published  

2015

JESD-609 Code  

e4

Part Status  

Active

Moisture Sensitivity Level (MSL)  

1 (Unlimited)

Number of Terminations  

2

ECCN Code  

EAR99

Terminal Finish  

Nickel/Gold (Ni/Au)

Capacitance  

58pF

Terminal Position  

BOTTOM

Terminal Form  

NO LEAD

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Time@Peak Reflow Temperature-Max (s)  

NOT SPECIFIED

Element Configuration  

Single

Speed  

Fast Recovery =< 500ns, > 200mA (Io)

Diode Type  

Schottky

Current - Reverse Leakage @ Vr  

75μA @ 40V

Voltage - Forward (Vf) (Max) @ If  

460mV @ 500mA

Case Connection  

ANODE

Forward Current  

1A

Operating Temperature - Junction  

-55°C~150°C

Output Current-Max  

1A

Forward Voltage  

480mV

Max Reverse Voltage (DC)  

40V

Average Rectified Current  

500mA

Peak Reverse Current  

100μA

Max Repetitive Reverse Voltage (Vrrm)  

40V

Capacitance @ Vr, F  

35pF @ 4V 1MHz

Max Forward Surge Current (Ifsm)  

18A

Reverse Voltage (DC)  

40V

RoHS Status  

ROHS3 Compliant